Offers “STMicroelectronics”

Expires soon STMicroelectronics

Technical Process Engineer - WLCSP M/F

  • Internship
  • CHINA

Job description



General information

Reference

2020-4964  

Job level

40 - Experienced

Position description

Posting title

Technical Process Engineer - WLCSP M/F

Regular/Temporary

Regular

Job description

Primary interface between ST Divisions and subcontractor (OSAT) to ensure timely respond on technical events & enquiry from all GOBM stakeholders (external customer, Division / Groups, ST BEMT plants, internal support organization and OSAT).

Responsible to drive assembly and final test yield improvement of OSAT to meet GOBM KPI target. 

Support customer on-site audit and driving technical resolution in OSAT; especially at Test area.

Accountable to drive subcontractor for continuous improvement on technical KPI and initiatives such as PCN, QUAL pass, successful evaluations, BKM deployment etc.

Training subcontractor on ST’s technical requirement & tools.

Interface between OSAT and Division on product / package development / NPI, supporting technical review and production ramp up. 

Profile

Min. Bachelor Degree of Electrical / Mechanical Engineering

Min. 3 years experiences in WLCSP Process at Backend Assembly sites

Good process technology knowledge in Advance/traditional package technologies

Min. 2 years management experiences for x-function project deployment

Strong communication skills on reporting technical alert, know-how for deployment projects

Position localisation

Job location

Asia-Pacific, Taiwan, Republic of China, Hsinchu

Candidate criteria

Education level required

4 - Bachelor degree

Experience level required

2-5 years

Languages

English (2- Business fluent)

Requester

Desired start date

10/03/2020

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