Microelectronic Packages Development Engineer M/F

Job description

General information

Reference

2020-4618  

Job level

30 - Graduate Entry Level

Position description

Posting title

Microelectronic Packages Development Engineer M/F

Regular/Temporary

Regular

Job description

Within the Packaging Engineering & Development team he/she will  :

Manage/Lead microelectronic packages development or industrial change projects in coordination with the different stakeholders of the Business Units, the ST laboratories and production sites, the subcontractors and the suppliers. The projects will mainly aim to develop new packages/assembly technologies or to optimize existing processes. He/she will be responsible to define, plan and manage the different stages of the development or engineering activity.
Develop packaging and assembly processes supporting the customers demands and the Business Units product roadmap. Capitalizing on his/her technical competencies, new packages, materials or processes will be developed.
Contribute to the continuous improvement activities by modifying existing packages or assembly processes to enhance their performance, cost, quality or yield.
Support the different teams (Quality, Plants, Laboratories, Marketing…) of ST with his/her expertise. He/she will contribute to the new products feasibility studies and developments, to quality problem solving working groups and to technical support and advice to marketing.

Profile

Master degree in Material Sciences

Project management tools knowledge (MS Project,…)

English language mastered

Creativity, Autonomy & initiative

Mobility and flexibility with several travels in Asia per year.

3 to 5 years of experience in an industrial activity.

Position localisation

Job location

Europe, France, Tours

Candidate criteria

Education level required

5 - Master degree

Experience level required

2-5 years

Languages

·  French (4- Mother tongue)
·  English (2- Business fluent)

Requester

Desired start date

01/02/2020