FBEOL / Packaging Engineer - Quantum computing technologies

Job description

IBM is seeking a FBEOL Packaging Engineer to work at its T.J. Watson Research Lab in Yorktown Heights, NY.

We are seeking a candidate with background in semiconductor/superconductor processing for quantum computing applications in a prototyping research fabrication lab.

The candidate should have a degree in chemistry, physics, materials science or a related engineering program and would have several years of experience in semiconductor fabrication. A masters or PhD degree in science or engineering is preferred. The job entails a high degree of autonomy and the ability to work well with others in a research and development environment, with key deliverables and milestones throughout the year.

Auto req ID

298624BR
Required Education

Master's Degree
Role ( Job Role )

Hardware Developer
State / Province

NEW YORK
Primary job category

Hardware Development & Support
Company

(0147) International Business Machines Corporation
Contract type

Regular
Employment Type

Full-Time
Is this role a commissionable/sales incentive based position?

No
Travel Required

Up to 10% or 1 day a week
IBM Business Group

Research
Preferred Education

Master's Degree
City / Township / Village

YORKTOWN HEIGHTS
Being You @ IBM

IBM is committed to creating a diverse environment and is proud to be an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, genetics, disability, age, or veteran status. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.
Required Technical and Professional Expertise

* At least 3 years experience in microelectronics materials and process integration
* At least 3 years experience in materials science or similar research.

Country/Region

United States
Preferred Technical and Professional Experience

* At least 5 years experience in microelectronics materials and process integration
* At least 1 year experience in semiconductor patterning
* At least 3 years experience in Far Back End of Line (FBEOL) / 3d Integration / chip packaging
* Experience with fabrication processes for quantum computing applications is a plus.
Secondary Job Category

Other Hardware Development & Support
Eligibility Requirements

·  None
Position Type

Professional
Early Professional Track

Not Applicable - Professional Hire
Location Statement

For additional information about location requirements, please discuss with the recruiter following submission of your application.
Introduction

IBM's Brain Inspired Computing team at IBM Research - If you have strong desire to build state-of-the-art digital chips and systems join us and let's reshape the future of AI.
Your Life @ IBM

Join us as we do pioneering work in areas such as cognitive computing, augmented intelligence, quantum computing, and blockchain, to name a few.
About Business Unit

With more than 3,000 researchers in 12 labs located across six continents, IBM Research brings together hundreds of researchers who possess unparalleled industry expertise to address some of the world's most challenging problems. Join us as we do pioneering work in areas such as cognitive computing, augmented intelligence, quantum computing, and blockchain, to name a few.
About IBM

The IBM Research Division conducts scientific research and develops technologies and processes for use with IBM products and customer applications. IBM Research has produced leading contributions to the technology underlying IBM's product portfolio, as well as to the world of science and the entire IT industry. For more information please visit www.research.ibm.com.

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